The Micro-Post is the cheapest and most flexible method,
for reliably connecting bare die to any substrate material!
 

 
  The Micro-Post process uses industry standard thermosonic ball bonding
equipment, to attach and extrude gold, copper or aluminium wire, forming
tiny connections, whose height can be more than 5 times their diameter,
thereby converting each die into a CHIP-SIZED PGA!!.
 

 
 
   
 

 
 

These Micro-PGAs can be fully tested and attached to just about any
board material, using all of the currently available Flip-chip techniques.

NEWS FLASH: Endicott Industries achieve 1000 Cycles, -55°C to 150°C, using µPOSTs
Now available, in volumes ranging from one part upwards.
Contact SEMI-DICE UK for further information!

Want to know more?
Send an E-Mail to elwynw@micro-designs.co.uk
or info@semidice.co.uk