Elwyn has now worked for nearly 40 years in IC Packaging.
He has had hands on experience of all of the main assembly processes, used in both
commercial and high reliability products. He is the named inventor on
several patents, relating to BGA, System-in-Package and Flip-Chip assembly and
has designed and sourced IC Packages for several highly inovative package products,
working with some of the worlds major assembly sub-contractors.

If you have an IC Packaging problem, why not ask Elwyn?

This service is free to all UK fabless silicon companies.
Just send an e-mail with "Ask Elwyn" on the subject line to....

Email. elwynw@micro-designs.co.uk