Starting with your GDSII or ASCII pad coordinates and descriptions;
We will produce a graphic of the die ready for inclusion in Microsoft, AutoCAD, or Gerber software;
We will then attempt to source an open tooled solution for either prototype or volume assembly;
If none are available, we can design custom leadframes or laminates to the latest OSAT design rules;
If time and cost is a major issue, we can provide chip-on-board assembly, through SDUK Ltd;
For very complex myulti-physics designs, we have also access to thermal, mechanical and electrical modelling:
MDC can help across the whole IC Package design cycle - test chip to flip-chip and beyond.

For existing parts with high cost, low yield, poor performance, or field failures;
We can redesign into proven solutions available from several suppliers and
Provide advice and training on IC Package assembly methods.
MDC have access to package data-bases for several major Off-shore, Assembly and Test houses
and can work with any form of IC packaging from bare die and CSP to SiP and EWLP.

Maybe your cost-sensitive, high-Speed, power-hungry, or delicate chip is not
suitable for any of the currently available packages.
MDC are skilled at Chip-On-Board design and can use our patented Micro-Post
technology to flip-chip attached conventional ICs directly onto any board material.

The business model for Micro-Design Consultants is based on private indivduals
working from home, on their own equipment and so without agents commissions and normal office
overheads, our rates are highly competitive. For quotes and further information.

Email. elwynw@micro-designs.co.uk
Skype. elwynw
Phone (office). +44 1354 691751
or Mobile. +44 7889 013006